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 Power Supply IC Series for TFT-LCD Panels
5V Input Multi-channel System Power Supply IC
BD9862MUV
No.10035EAT16
Description The BD9862MUV is a 3ch system power supply for mobile TFT liquid crystal panels.Operable at VBAT=1.8V, CH2 & CH3 adopts the original PWM/PFM automatic switching control charge pump and realizes high efficiency in full-load range. Features 1) Input voltage range: 1.8V~4.5V (The input voltage can be 5.5V if a double charge pump is not used) 2) The step-up switching regulator has a built-in output FET (CH1) 3) There is a built-in PWM/PFM automatic switching charge pump circuit with a fixed PWM terminal (CH2,3) 4) Switching regulator oscillation frequency: MHz(typ.) 5) Charge pump oscillation frequency: 500kHz(typ.) 6) There is a built-in circuit to discontinue output (timer latch type) in the event of overload 7) Package VQFN024V4040 Applications Small & medium TFT liquid crystal displays etc. Absolute Maximum Ratings (Ta = 25C) Parameter Maximum adding power supply voltage
Maximum adding voltage
Symbol VBAT LX FB1, INV1, INV2, UVLOSET, C2N, VIN2A, CN, CP, CPOUT, REGOUT, PWM, RT ,VREF ,NON3 VIN3, C3P, Vo2, C2P, VIN2B Pd Topr Tstg Tjmax
Ratings -0.3 ~ 7 -0.3 ~ 18 -0.3~7 -0.3~15.5 0.34(*1) 0.70(*2) -40 ~ +85 -55 ~ +150 +150
Unit V
V
Power dissipation Operating temperature range Storage Temperature Range Junction temperature
W
(*1) When used as a stand-alone IC (for Ta=25 and over), the value is reduced by 27mW/. (*2) When used for Printed Circuit Boards (glass epoxy board of 74.2mmx74.2mmx1.6mm) mounting for Ta=25 and over, the value is reduced by 5.6mW/.
Operating Conditions(Ta=25) Parameter Power Supply Voltage CH1Output Voltage CH2 Output Voltage CH3 Output Voltage Starting capacity, adding charge pump flying capacitor Reversing capacity charge pump flying capacitor Starting charge pump Output capacitance Switching regulator oscillation frequency Charge pump oscillation frequency CH1 PowerNMOS Drain current Symbol VBAT Vo1 Vo2 Vo3 Cflys,Cflya Cflyi CCPOUT fOSC1 fOSC2 Iidn1 MIN 1.8 -15 0.1 0.022 1.0 700 350 Ratings TYP 0.22 0.047 2.0 1.0 500 MAX 4.5(1) 15 15 1.4 700 1.0 Unit V V V V F F F MHz kHz A CCPOUTCfly*10 RRT=82k~180k RRT=82k~180k condition
(1) When using a double charge pump for starting. 5.5V when not using a double charge pump
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1/16
2010.03 - Rev.A
BD9862MUV
Electrical Characteristics (unless otherwise specified,Ta=25,VBAT=2.5V) Limits Parameter Symbol MIN TYP MAX Starting circuit part Output voltage VBAT Voltage to start operation Soft start part CH1Soft start time CH2 Soft start time CH3 Soft start time Oscillation circuit Switching regulator frequency Charge Pump Frequency Regulator Output Voltage PWM Comparator MAX Duty1 MAX Duty2 MAX Duty3 Error amplifier INV1Threshold Voltage INV2Threshold Voltage NON3Threshold Voltage CH3 Error amplifier off set voltage Output part(Switching Regulator NMOSFET ON Resistance Leak current when NMOSFET OFF Adding step-up charge pump Output impedance Inverted charge pump Output FET ON resistance PMOS NMOS RonP3 RonN3 RPWM VPWMH VPWML Latch UVth UVhy 0.5 1.2 0 110 0.97 50 20 10 1 131 1.0 75 40 20 2 VBAT 0.3 150 1.03 100 VIN3=10V R2 53 90 RonN1 IreakN1 0.2 0.45 0.7 10 A VINV1 VINV2 VNON3 Voffset 0.985 0.985 0.985 -50 1.0 1.0 1.0 0 1.015 1.015 1.015 50 V V V mV Dmax1 Dmax2 Dmax3 85 40 40 90 45 45 95 50 50 % % % VREGOUT 3.4 3.5 3.6 V fosc1 fosc2 0.9 450 1.0 500 1.1 550 MHz RRT=120k kHz RRT=120k Tss1 Tss2 Tss3 0.5 3.5 3.5 1.0 5.0 5.0 2.0 6.5 6.5 ms ms ms RRT=120k RRT=120k RRT=120k Vcpout Vst 3.7 4.2 4.7 1.8 V V Iout=0~10mA
Technical Note
Unit
Condition
Iout=0~10mA,VBAT=2.0V~4.5V
Making VREF as absolute value
REGOUT=3.5V UVLOSET=0V Io=0~10mA,VIN2A=3.5V, VIN2B=10V,INV2=GND
Control Terminal Part PWM Terminal pull down resistance PWM Terminal control voltage Timer Latch Time UVLO Relief voltage threshold Hysteresis Circuit current Circuit current during operation (VBAT terminal inflow current)
It is not the radiation-proof design for this product.
M V V ms V mV VBAT=5V, UVLOSET=INV1=INV2=5V NON3=-0.2V PWM Fixed mode PWM/PFM Auto shift mode RRT=120k
Operation Non-operation
Short circuit protection circuit
IVBAT
0.4
0.8
1.6
mA
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2/16
2010.03 - Rev.A
BD9862MUV
Power Dissipation Reduction
Technical Note
4.5 4.0 3.5
: Stand-alone IC : One-layer substrate (Surface-layer heat release copper foil 0mm2) : Four-layer substrate (Surface and inside-layer heat release copper foil 10mm2) (2, 3 layer heat release copper foil 5505mm2) : Four-layer substrate (All-layers heat release copper foil 5505mm2)
3.56W
Power Dissipation Pd W)
3.0 2.5
: ja = 367.6/W : ja = 178.6/W : ja = 56.6/W : ja = 35.1/W
2.21W
2.0 1.5 1.0 0.5 0.0 0 25 50 75
0.70W 0.34W
100
125
150
Ambient Temperature Ta()
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3/16
2010.03 - Rev.A
BD9862MUV
Reference Data(Unless specified Ta=25,VCC=2.5V,RRT=120k)
Technical Note
90 85 80 75 70 65 60 55 50 45 40 1
90 L=15uH 85 L=4.7uH 80 75 70 65 10 Load current[mA] 100 0.1 1 Load current[mA] 10 PWM MODE PWM/PFM MODE
50
PWM/PFM MODE
48 efficiency[%] 46 44 42 40 38 36 0.1 1 Load current[mA] 10
PWM MODE
efficiency[%]
Fig.1 CH1Current Load to Efficiency (Vo1=10V)
3.6
Fig.2 CH2 Current Load to Efficiency (VIN2A=3.5V,VIN2B=10V,Vo2=12V)
3.520 REGOUT voltage[V]
efficiency[%]
Fig.3 CH3 Current Load to Efficiency (VIN3=10V,Vo3=-5V)
3.518 3.516
REGOUT voltage[V]
3.515
REGOUT voltage[V]
3.59 3.58 3.57 3.56 3.55 0 5 10 Load current[mA] 15
3.514 3.512 3.510 3.508 3.506
3.510 3.505
3.500 3.6 4.0 4.4 4.8 5.2 CPOUT voltage[V]
3.504 -40 -15 10 35 60 85 Ta[]
Fig.4 REGOUT Output Load Regulation
1.006 INV1 threshold voltage[V]
INV2 threshold voltage[V] 1.006
Fig.5 REGOUT Output Line Regulation
Fig.6 REGOUT Output Voltage Temperature Feature
1.012 NON3 threshold voltage[V]
1.005
1.005
1.011
1.004
1.004
1.010
1.003
1.003
1.009
1.002 -40 -15 10 35 60 85 Ta[]
1.002 -40 -15 10 35 60 85 Ta[]
1.008 -40 -15 10 35 60 85 Ta[]
Fig.7 INV1 Threshold Voltage Temperature Feature
Fig.8 INV2 Threshold Voltage Temperature Feature
Fig.8 NON3 Threshold Voltage Temperature Feature
100 90 80 70 60 50 40 30 20 10 0 0.6 0.8 1 1.2 1.4 1.6 1.8 FB1 voltage[V] 2
1015 1010 frequency[kHz] 1005 1000 995 990 985 -40 -15 10 35 Ta[] 60 85
frequency[kHz]
1050 1040 1030 1020 1010 1000 990 980 970 960 950 2 3 4 VBAT[V] 5
Duty[%]
Fig.10 CH1 FB1VoltageOn Duty Feature
Fig.11 CH1 Switching Frequency Temperature Feature
Fig.12 CH1 Switching Frequency to VBAT Voltage Feature
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4/16
2010.03 - Rev.A
BD9862MUV
Reference data(Unless specified Ta=25,VCC=2.5V)
Technical Note
1.01 1.005 1 0.995 0.99 0.985 0.98 0.975 0.97 0.965 0.96 0.955 -40 -15 10 35 Ta[] 60 85
5.08 5.06 soft start time[ms] 5.04 5.02 5 4.98 4.96 4.94 -40 -15 10 35 Ta[] 60 85
Max duty[%]
91.2 91.1 91 90.9 90.8 90.7 90.6 90.5 90.4 90.3 -40 -15 10 35 Ta[] 60 85
soft start time[ms]
Fig.13 CH1 Soft Start Temperature Feature
Fig.14 CH2,CH3 Soft Start Temperature Feature
Fig.15 CH1 Max Duty Temperature Feature
46 45.9 45.8 45.7 45.6 45.5 45.4 45.3 45.2 45.1 45 -40 -15 10 35 Ta[] 60 85
1500 1400 1300 frequency[kHz] 1200 1100 1000 900 800 700 600 60 80 100 120 140 160 180 200 R RT [kOhm]
Max duty[%]
Fig.16 CH2,CH3 Max Duty Temperature Feature
Fig.17 RT Resistance to CH1 Switching Frequency Feature
Block Diagram
CP CN CPOUT REGOUT INV1 VBAT VBAT REGOUT VBAT VBAT 500kHz CLK
Ring OSC for startup SELECTOR
FB1 Error Amp1 CPOUT CLK x2 C.P. CPOUT 1.2V LDO REGOUT UVLO H:Vout OFF L:Vout ON Soft Start PWM Comp1
LX Step Up Switching Control
VBAT PFM Control
1.0V SS1 OK
REGOUTUVLO:L OK INV2 VIN2A DRIVER PWM/PFM Control Max Duty CP SS2 OK Min Duty PWM VIN2B C2N PGND2
+
ref2
CLK Control Comp PWM Comp2
500kHz CLK
REGOUT 1MHz SLOPE 1.0V CLK Soft Start SS3 OK
Error Amp2
RT
OSC
GND
VBAT TSD
VBAT
REGOUT 1.2V
Max Duty1 Max Duty CP
1/2 f DISCHARGE
VREF & IREF VBATUVLO:L PWM HPWM LPWM/PFM Auto VBATUVLO:L
Min Duty VIN3
Error Amp3
VBAT
UVLOSET
+
1.0V/0.9V
VBATUVLO H:IC OFF L:IC ON 1.2V
VBAT ref1(1.0V) REGOUT ref2(1.0V) 0.7V INV1 ErrAmpOUT2 ErrAmpOUT3 2.0V NON3
1.0V CLK
Soft Start
SS3 OK
SCPCOMP
SS2 OK
SS1 OK
Fig.18
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5/16
+ -
+ +
+
VBAT VREF
SCP COUNTER
+
1.0V
SCPOUT CHI-CH3 Driver stop CH1CH3
+ -
+ + -
+ Max Duty1
PGND1
+ -
DRIVER
C2P VO2
+ PWM Comp3 Max Duty CP
PWM/PFM Control
DRIVER
C3P
Min Duty
PWM
PGND2
-
REGOUT UVLO:L
VREF Buffer
2010.03 - Rev.A
BD9862MUV
Terminal Location Diagram
18 19 20 21 22 23 24 1 2 3 4 5 6 17 16 15 14 13 12 11 10 9 8 7
Technical Note
Fig.19
Terminal Number and Terminal Name and Function Terminal Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Terminal Name FB1 INV2 UVLOSET VIN3 C3P PGND2 C2N VIN2A VO2 C2P VIN2B LX PGND1 CN CP VBAT CPOUT REGOUT PWM GND RT VREF NON3 INV1 Function Error amplifier output terminal for CH1 Error amplifier inverted input terminal for CH1 UVLO Standard voltage terminal Reversing charge pump input terminal Reversing charge pump. Flying capacitor H-side input terminal Built-in EFT grounding terminal for CH2,3 Adding step-up charge pump. Flying capacitor L-side input terminal Adding step-up charge pump input terminal Adding step-up charge pump output terminal Adding step-up charge pump. Flying capacitor H-side input terminal Adding step-up charge pump input terminal Inductor connecting terminal Built-in FET grounding terminal for CHI1 Start-up charge pump. Flying capacitor L-side input terminal Start-up charge pump .Flying capacitor H-side input terminal Power supply input terminal Start-up charge pump output terminal Regulator output terminal Charge pump block PWM/PFM switching terminal Grounding terminal Connecting terminal of resistor for frequency timing setting Standard voltage output terminal Non-reversing input terminal of error amplifier for CH3 Reversing input terminal of error amplifier for CH1
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6/16
2010.03 - Rev.A
BD9862MUV
Technical Note
System Description BD9862MUV is a 3ch system power supply optimized for TFT liquid crystal displays. Features of each channel are explained as follows CH1 This is a voltage mode switching regulator with a built-in high voltage-resistant output FET. Capable of high-speed operation at the maximum switching frequency of 1.4MHz, and compatible with a high step-up ratio with Max Duty of 90%(typ.). CH2 It's a PWM/PFM automatic switching control with a variable-voltage adding charge pump. Due to intermittent switching at the time of PFM mode, the switching loss is reduced, so high efficiency is realized even in light load conditions. Moreover, it is capable of operating at the maximum switching frequency of 700KHz because of a built-in high voltage resistant, high-speed FET driver. In addition, it is equipped with an On Duty prediction function, so the output voltage ripple is lowered considerably even at the time of PFM operation.Due to the built-in output discharge resistor (1k typ.) and FET phase compensation circuit, it can operate with two capacitors and two resistors. CH3 It includes a PWM/PFM automatic switching control, variable-voltage reversing charge pump controller. The control method is the same as CH2. Block functional descriptions Error amplifier block Detects the output voltage with INV terminal (NON3 terminal in case of CH3), amplifies the error between it and standard voltage, and outputs from the FB terminal. The accuracy is 1%(1.5% in case of CH2 & CH3). PWM(Pulse Width Modulation)Convertor block The PWM convertor inputs the error detected by the error amplifier and outputs the PWM signal by comparing with a saw-tooth wave. PWM/PFM Control Block Due to the input of the PWM terminal, this block switches the CH2 & CH3 between the fixed PWM mode and the automatic switching mode of PFM(Pulse Frequency Modulation)/PWM. At the time of PFM mode, the efficiency under a light load is raised by controlling and making the lowest On Duty of PWM signal to be 7%(typ.) and reducing the number of switching times. LDO Block This is a power supply to operate the internal circuit. In addition, it can be used as input of VIN2B. The output voltage is 3.5V(typ.), and the maximum load is 10mA. Moreover, due to a built-in UVLO, the release voltage is 2.5V(typ) and the protective voltage is 2.4V(typ). Start-up Charge Pump Block If REGOUT is 2.5V(typ.), then the ring oscillator, which operates at 500kHz or so, is started and the double charge pump is operated. The clock pulse is controlled in such a way that the output voltage of this charge pump becomes 4.2V(typ.). Moreover, if REGOUT becomes more than 2.5V(typ.) (i.e. REGOUT2.5V(typ.)), then the clock is supplied from the main OSC that creates a saw tooth wave. If the input voltage is usually more than 4.5V, then it is possible to bypass the start-up circuit. (refer to the application example) OSC Block It generates a saw-tooth wave and inputs it into the PWM comparator. It is possible to change the oscillating frequency by means of the resistor RT. Due to RRT=120k, the CH1 operates at 1MHz(typ.). The double charge pump, CH2 and CH3 operate at 1/2 of CH1 frequency. VREF Block Generate the constant voltage that is standard inside the IC. UVLO Block Performs the under voltage lockout by detecting the VBAT voltage with the UVLOSET terminal. The UVLO voltage can be set by an external resistor. Soft Start Block Due to sweep-starting of the standard voltage of the error amplifier at the time of start-up, the excess input current & output voltage is reduced. Moreover, only at the time of soft start, the CH2 is regarded as the resistance value of 150typ between VIN2B & C2P and the CH3 is regarded as the resistance value of 60typ between VIN3 & C3P therefore the input current is limited. Short-circuit protection of timer latch (SCP) block Monitors the INV1 terminal and the error amplifier outputs of CH2 & CH3, and turns off the drivers of CH1~CH3 if a short-circuit condition continues for more than a certain period of time. The timer latch time is counted by the CH1 internal switching pulse. The counting is started when a short-circuit condition begins, ant the drivers are turned off when 131,072 is reached. Example) if RRT=120k, then 131072x(1/1[MHz])=131.072ms Thermal shutdown (TSD) block Detects abnormal heat generation of the IC, stops the switching operation of all Ch and prevents the IC from thermal overload. The detecting temperature is 175(typ), and the hysteresis is 10(typ).
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7/16
2010.03 - Rev.A
BD9862MUV
Timing Chart 1) When Starting
Technical Note
VBAT
VBATUVLO release VBATUVLO 2 times charge pump 2 Start on
CPOUT
Regulator Start on
REGOUT
REGOUTUVLO REGOUTUVLO Relief
Vo1
CH1 CH1 Start on
Vo1 Soft start Vo1 close
Vo2
CH2 Start on CH2
Vo3
CH3 Start on CH3 Vo3Vo3 Soft start close
CH All CH Start close
Fig.20 2) Sample SCP Operation When CH1 is short
Vo1 Output Short Circuit Vo1
Vo1
INV1
0.7V
SCP Capacitor SCP Output (internal) SCP Timer SCP operation SCP Latch
SCP (Internal)
Driver stop
(CH2, CH3 stop too)
Lx1
CH2,CH3
Normal operation
MAX Duty operation MAX Duty
SCP
Fig.21
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8/16
2010.03 - Rev.A
BD9862MUV
3) Sample SCP Operation When CH2 is Short
Output short
Technical Note
Vo2
ERROR OUT2 (INTERNAL)
2V ERROR OUT2()
OS CSLOPE() OSC SLOP (INTERNAL)
Driver stop
C2N
(CH1, CH3 stop too)
(CH1,CH3
SCP Capacitor SCP Output (Internal) SCP latch SCP (Internal)
SCP Timer operation SCP
Normal operation
MAX Duty operation
MAX Duty
SCP
Operates similarly at the time of CH3 short-circuit.
Fig.22
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9/16
2010.03 - Rev.A
BD9862MUV
Technical Note
Method to select the application parts 1) Setting of output voltage The output voltage VOUT is set by dividing the resistance of the external resistor. CH1,CH2:VOUT=1+R2/R1 CH3:VOUT=-((R4/R3)+Voffset) R1: Feedback resistor (GND side), R2: Feedback resistor (VOUT side), R3: Feedback resistor (VREF side), R4: Feedback resistor (VOUT side) 2) Setting of the output inductor The maximum current ILpeak that flows in the inductor is calculated by the sum of the average current I L and the maximum value of ripple current IL. ILpeak = I L + IL. Generally IL. is set to about 30% of I L. The average current I L and the ripple current IL. are calculated according to the following formulas. Vin min Vout Vin V out IL IL max I out max 2 f osc L Vout Vin min L: value of inductance fOSC: switching frequency Vinmax: maximum input voltage Vinmin: minimum input voltage Vout: set value of output voltage Please set in such a way thatILpeak (the rated value of inductor current) is not exceeded. If ILpeak exceeded, then the efficiency is lowered extremely and damage to the inductor is caused. Please set in such a way that a good margin is left because the inductance varies in value. 3) Setting of output capacitor The capacitance & ESR of the output capacitor is influenced a great deal by output voltage ripple. Moreover, PFM mode intentionally makes the switching intermittent, so the output voltage ripple becomes larger compared with PWM mode. Please use an appropriate capacitor according to the service condition. In addition, please be sure to connect a ceramic capacitor of 1F to REGOUT terminal. It is assumed that this IC uses a multilayer ceramic capacitor. For small multilayer ceramic capacitors such as Size 1608 etc., its actual capacitance may be lower than its nominal one because of the voltage that is bypassed. Please check to confirm various characteristics such as DC bypass etc. before use. 4) Setting of flying capacitor Please set the capacitance of the flying capacitor of the start-up charge pump not to exceed 1/10 of the capacitance of the CPOUT output capacitor. If it is more than 1/10 of the capacitance, damage may be caused. 5) Setting of the input capacitor A bypass capacitor for input is necessary to the VBAT terminal. Due to input & output voltage, load and wiring pattern etc., the actual capacitance is different from the necessary one, so please carefully check to confirm. 6) Setting of CR for phase compensation The CR for phase compensation is varied due to the characteristics of the capacitor & inductor, which are used in the output part, the input & output voltage and the load current etc. The phase-compensation CR constant in a recommended circuit diagram is set according to the service conditions, but applications under other conditions than the various conditions mentioned will cause oscillation instability etc. Please contact our technical service department if any conditions are changed. 7) Setting of schottky diode in the output part Please use a schottky diode with an allowable current more than ILpeak for the output part. Furthermore, it is necessary that the maximum reverse voltage is more than output voltage. Generally speaking, more lower the forward voltage, the higher the efficiency. 8) Setting of UVLO voltage The VULO release voltage VUVLO can be set according to the following formula: VUVLO=1+R2/R1(R1=GND-side resistance R2=VBAT-side resistance) If you want to make the start-up of the IC to lag behind the rising edge of VBAT, connect a capacitor to the UVLOSET terminal and set the time constant. 9) Setting of oscillating frequency Oscillating frequency can be adjusted by a resistor connected to the RT terminal. The CH1 oscillating frequency fosc1 is determined by the formula shown below: -12 -8 fosc1=1/(8x10 xRRT+4x10 ) The frequency calculated by the formula shown above is a theoretical value, so please refer to the above-mentioned reference dataRT resistance vs. CH1 switching frequency characteristicfor actual frequency.

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10/16
2010.03 - Rev.A
BD9862MUV
Technical Note
Operating Guidelines PWM terminal At Low the PFM mode skips the pulse of less than 7% On Duty. It is also switched over to the PWM mode if a certain amount of load is reached or exceeded while in PFM mode. Moreover, it is switched to PFM mode if the load becomes light. Please set the PWM terminal to High and use as the forced PWM mode if there is an influence of noise created by modulation of the switching frequency. SCP Function In case of circuit stoppage due to SCP, the protection is released by setting the UVLOSET voltage to L and the VBATT to OFF. CH2 adding charge pump Please set the Vo2 so that the VIN2A+VIN2B become not more than 15V because the voltage that is the sum of the VIN2A voltage plus the VIN2B voltage is applied.
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11/16
2010.03 - Rev.A
BD9862MUV
Sample of Recommended Circuit 1) Sample of Input voltage 1.8V~4.5V application
Vin= 1.8~ 4.5V
Technical Note
CflyS 0.22uF
CN CPOUT CCPOUT 2.2uF REGOUT VREG CREGOUT 2.2uF Regulated Charge Pump
CP
VBAT
L1 LX D1 step-up DC-DC VREF VREF PGND1 INV1 RT OSC FB1 120kO VIN2A VBAT or REGOUT VIN2B H:PWM L:PFM PWM PWM or PFM Control ADD Charge Pump C2P C2N VO2 2.2MO INV2 200kO Thermal Shut Down X-1 Charge Pump COUT2 2.2uF Cfly2 0.047uF COUT1 10uF
200kO
300pF 1kO
680pF 12kO
22kO
GND
VIN3 C3P Cfly3 0.047uF D3 COUT3 2.2uF
Short Circuit Protection
Soft Start 91kO 110kO
NON3
100kO
UVLOSET
20kO UVLO PGND2
Fig.23 Recommended Parts L1 : NR4010T4R7M(TAIYO YUDEN) D1 : RB161VA-20(ROHM) D3 : DAN217U(ROHM) COUT1 : GRM31CB31C106KA88(MURATA) CIN : GRM219B30J106KE18(MURATA) CCPOUT CREGOUT COUT2, COUT3 Cflys Cfly2, Cfly3 : : : : : GRM188B30J225KE18(MURATA) GRM155B30J105KE18 (MURATA) GRM188B31C225KE14D(MURATA) GRM155B10J224KE01(MURATA) GRM155B11C473KA01(MURATA)
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12/16
2010.03 - Rev.A
BD9862MUV
2) Sample of Input voltage 4.5V~5.5V application
Vin= 4.5~ 5.5V
Technical Note
CN CPOUT Regulated Charge Pump
CP
VBAT
L1 REGOUT VREG CREGOUT 2.2uF step-up DC-DC VREF VREF PGND1 INV1 RT OSC FB1 120kO VIN2A VBAT or REGOUT VIN2B H:PWM L:PFM PWM PWM or PFM Control ADD Charge Pump C2P C2N VO2 2.2MO INV2 200kO Thermal Shut Down X-1 Charge Pump COUT2 2.2uF Cfly2 0.047uF LX D1 COUT1 10uF
200kO
300pF 1kO
680pF 12kO
22kO
GND
VIN3 C3P Cfly3 0.047uF D3 COUT3 2.2uF
Short Circuit Protection
Soft Start 300kO 100kO
NON3
100kO
UVLOSET
20kO UVLO PGND2
Fig.24 Recommended Parts L1 : NR4010T4R7M(TAIYO YUDEN) D1 : RB161VA-20(ROHM) D3 : DAN217U(ROHM) COUT1 : GRM31CB31C106KA88(MURATA) CIN : GRM219B30J106KE18(MURATA) CCPOUT CREGOUT COUT2, COUT3 Cflys Cfly2, Cfly3 : : : : : GRM188B30J225KE18(MURATA) GRM155B30J105KE18(MURATA) GRM188B31C225KE14D(MURATA) GRM155B10J224KE01(MURATA) GRM155B11C473KA01(MURATA)
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13/16
2010.03 - Rev.A
BD9862MUV
Input / Output Equivalent Circuit LX
Technical Note
INV1, INV2, NON3
REGOUT
FB1
REGOUT
UVLOSET
VBAT
LX
INV1,2 NON3
FB1
UVLOSET
CN
VBAT
CP, CPOUT
CPOUT
REGOUT
CPOUT
PWM
REGOUT
CP
REGOUT
PWM
CN
VBAT
RT, VREF
REGOUT
VIN2A, C2N
VIN2A
VIN2B
VO2, C2P
Vo2
VIN2B
C2N
C2P
RT,VREF
VIN3, C3P
VIN3
C3P
Fig.25 Input / Output Equivalent Circuit Points for attention on PCB layout Place the resistors and capacitors, that are connected to RT, INV1, FB1, INV2, NON3 and VREF, close to the terminals to avoid being affected by the wirings, where switching is large, such as LX1 wiring and flying capacitor wiring etc. Place the inductor, schottky diode and flying capacitor close to the IC. Mount in such a way that the back side of the package serves as the GND potential which covers the largest space in the PCB. Heat dissipation performance is improved.
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14/16
2010.03 - Rev.A
BD9862MUV
Technical Note
Notes for Use 1.) Absolute maximum ratings This is a high quality product, but if absolute maximum rating such as applied voltage and operating temperature range is exceeded, then deterioration or breakdown may result. Moreover, such destructive conditions as short mode or open mode can not be assumed. If a particular mode such as exceeding the absolute maximum rating is assumed, consideration should be given to using physical safety measures such as a fuse. 2.) CND Potential The electric potential of the GND pin should be the lowest electric potential under any operating state. In addition, (including transient phenomenon), do not make the electrical potential of any pin lower than the GND's. 3.) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4.) Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. In addition, shorts between output pins or between output pins and the power supply GND pin caused by the presence of a foreign object may result in damage to the IC. 5.) Operation in a strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 6.) Common impedance Power supply and GND wiring should reflect consideration of the need to minimize ripples as much as possible., (which lower common impedance), by making wiring as short and thick as possible or incorporating inductance and capacitance. 7.) Thermal shutdown circuit (TSD circuit) This IC incorporates a built-in thermal shutdown circuit (TSD circuit). The TSD circuit is designed not for the purpose of protection & guarantee of the IC, but only to shut the IC off to prevent thermal overload. Therefore, do not use the IC on the premise that this TSD circuit will be operated to shut the IC off (or the IC will be continued to be used after this TSD circuit is operated to shut the IC off). 8.) IC pin input This monolithic IC contains the P+ isolation between adjacent elements in order to keep them isolated from the P substrate. Due to this P layer and the N layer of each element, the P/N junctions are formed and various kinds of elements are created. For example, if a resistor and a transistor are connected with pins as shown in the Fig., then: the P/N junction functions as a parasitic diode when GND > (Pin A) for the resistor or GND > (Pin B) for the transistor (NPN). Moreover, when GND > (Pin B) for the transistor (NPN), the parasitic NPN transistor is operated by N layer of other elements adjacent to the above-mentioned parasitic diode. The formation of parasitic elements as a result of the relationships of electric potentials is an inevitable result of the IC's architecture. The operation of parasitic elements can cause interference with the circuit operation as well as IC malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will trigger the operation of parasitic elements, such as by the application of voltages lower than the GND (P substrate) voltage to input pins. Resistance
(Terminal A) (Terminal B)
Transistor (NPN)
C
B
E GND (Terminal A)
Parasitic Element
P+ N N
P
P
+
P+ N N N
P
P+ N GND
P Substrate
Parasitic Element
P Substrate
Parasitic Element
GND
Fig.26 Simple Structure of monolithic IC (Sample)
www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved.
15/16
2010.03 - Rev.A
N
BD9862MUV
Ordering Part Number
Technical Note
B
D
9
Part No.
8
6
2
M
U
V
-
E
2
Part No.
Package MUV: VQFN024V4040
Packaging and forming specification E2: Embossed tape and reel
VQFN024V4040
4.00.1
4.00.1

Tape Quantity Embossed carrier tape 2500pcs E2
The direction is the 1pin of product is at the upper left when you hold
1.0MAX
1PIN MARK S
+0.03 0.02 -0.02 (0.22)
Direction of feed
( reel on the left hand and you pull out the tape on the right hand
)
0.08 S C0.2
1 24
2.40.1
6
0.40.1
19 18 13
12
0.75
0.5
2.40.1
7
+0.05 0.25 -0.04
1pin
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved.
16/16
2010.03 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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http://www.rohm.com/contact/
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R1010A


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